Our offshore center is well equipped to design and develop boards from pre- design stage to final gerber. Be it a processor card or a controller card or a specific application card we can architect, design, layout and also get the prototype.
We have developed multilayer, high density and very complex boards with large BGA packages. Our engineering team is very familiar with memory technologies, signal integrity and routing constraints with high-speed. Our Design centers and experienced designers can provide the following services:
Our offshore center is well equipped to design and develop boards from pre- design stage to final gerber. Be it a processor card or a controller card or a specific application card we can architect, design, layout and also get the prototype.
We have developed multilayer, high density and very complex boards with large BGA packages. Our engineering team is very familiar with memory technologies, signal integrity and routing constraints with high-speed. Our Design centers and experienced designers can provide the following services:
For your most stringent vertical ASIC/IP requirements, we work with you at all capacities from specification, abstract architecture modeling, implementation, verification and validation. We have complete range of skills and state of the art EDA tools knowledge that is critical to a successful tape-out and final silicon testing. Our expertise spans the entire ASIC/SoC design spectrum from specification to GDSII tape-out to silicon verification. We offer services that address most of your critical design needs or we can customize our services based on your specific requirements.
Following are Key tools experience
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